SinoGuide technical service staff can help engineers determine the appropriate materials for their application and heat transfer requirements. Thermal Conductive Pad, Silicone Soft Thermal Pads, Heat Transfer Pad and Heatsink Thermal Pad.
Thermal interface material(TIM) or Thermal Pad is space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product.
Thermally Conductive Gap Pad Product Line
What is so called thermal pad? All thermal conductive pad family products are thermal interface materials, which are used to fill in air gaps between heat-generating electronic device and heatsinks or metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high conformability.
- Thermal Conductivity: 0.2 W/m.k;
- Thermal Conductivity: 1.0 ~ 7.5 W/m.k;
- Premium Thermal Conductivity: 30~50W/m.k;
REACH, RoHS, UL Compliant;
SinoGuide Thermal Product Catalogue
Thermal Pad Typical Features – HIGH PERFORMANCE SinoGuide THERMAL INTERFACE MATERIALS
Soft with high compressibility to reduce thermal resistance and enhance thermal conductivity optional thermal conductivities for your cooling applications. Naturally sticky cost effective solutions with competitive price. Thermally conductive silicone rubber heat transfer pads and gaskets for all your thermal solutions.
SinoGuide brand thermal pads are ideal for height differences and unevenness in heat sinks and to bring the elements to be cooled. Given their high elastic and low hardness is achieved already by a low pressure is a very good fit to the surface. There are balanced all the large and small differences in elevation, even of microscopic grooves to visible imperfections.
Thermal Pad Main Applications Blow
– Between electronic components such as semiconductor, CPU, MOS, IC and heatsink.
– LCD TV, Telecom device, wireless Hub, NB, PC, Led Lighting, power supply etc.
– Cooling Module, Thermal Module, in all applications where a metal housing is used as heatsink.
– Heat pipe interposer plates Laptop PCs, high-density handheld portable electronics, electronic ballasts & various automotive applications.
Thermal Pad Type Selection
|Thermal Pad Type||Application Guidelines||Thermal Conductivity||Test Method|
|TCP110U||Fiberglass Reinforcement and Good thermal conductivity pad||1.1||ASTM D5470|
|TCP100||Ultra Soft, General purpose heat transfer pad||1.0||ASTM D5470|
|TCP150||Good thermal conductivity gap filler pad with nylon mesh||1.5||ASTM D5470|
|TCP200||Good thermal conductivity thermal pad with nylon mesh||2.0||ASTM D5470|
|TCP300||High performance conductivity gap pad||3.0||ASTM D5470|
|TCP500||High performance conductivity gap pad w/hardened side||5.0||ASTM D5470|
|TCP600||High performance conductivity gap pad with nylon mesh||6.0||ASTM D5470|
|TCP750||Very high heat conductivity gap pad||7.5||ASTM D5470|
|TCP20||Low conductivity, high compressible closed-cell silicone foam||0.2||ASTM D5470|
|AL20||Carbon fiber filled, Highest performance heat conductivity thermal pad||35||ASTM D5470|
|AL50||Carbon fiber filled, Premium thermal conductivity pad||50||ASTM D5470|
|TCSF200||High performance heat conductivity silicone free thermal pad||2.0||ASTM D5470|
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Other Commonly Used Thermal Interface Materials
Sinoguide Technology Disclaimer:
***Any information contained herein is believed to be accurate and reliable. Sinoguide Corporation and its agents does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any final products into which the product(s) may be incorporated by the purchaser and/or user. The purchaser and/or user should perform its own tests to determine the suitability and fitness of the product (s) for the particular purpose desired in any given situation.