thermal pads
Full Range Of Thermal Conductive Pad
Premium Thermally Conductive Pad Selection Guide (35, 50W/m.k)
Features and Benefits:
◇ 35 and 50 W/mk Outstanding Thermal Conductivity
◇ Carbon Fiber Filled,High Stability and Suitable For Extreme Enviroment
◇ Non- tacky and good rebound for easy applicaiton
Typical Properties of Premium Thermal Pads | |||||||
Properties | Units | AL20 | AL50 | Test Method | |||
Construction & Composition | — | Carbon Loaded Silicone | Carbon Loaded Silicone | — | |||
Color | — | Black | Black | Visual | |||
Thickness | mm | 0.50 to 3.0 | 0.30 to 3.0 | — | |||
Thickness Tolerance | +/-0.02mm | +/-0.02mm | — | ||||
Hardness | (Shore 00) | 20 | 50 | ASTM D2240 | |||
Density(g/cm) | — | 2.4 | 2.4 | ASTM D792 | |||
Continuous Use Temp | ℃ | 200 | EN344 | ||||
Breakdown Voltage | (AC kV/mm) | <0.1 | <0.1 | ASTM D149 | |||
Withstand Voltage | (AC kV/mm) | <0.1 | <0.1 | ASTM D149 | |||
Volume Impedance | (ohm-cm) | <500 | <500 | ASTM D257 | |||
Flame Rating | V 0 | V 0 | UL 94 | ||||
Specific Heat Capacity | — | 0.87 J/g-k | 0.87 J/g-k | ASTM D5470 | |||
Thermal Mass | — | 2088 kj/m3-k | 2088 kj/m3-k | ASTM D5470 | |||
Thermal Conductivity | W/m.k | 35 | 50 | ASTM D5470 |
Widely Used Thermal Conductive Pad Selection Guide (1.0~7.5 /m.k)
Features and Benefits:
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- ◇All thermal conductive pad/gap pad are used to fill in air gaps between heat-generating electronic component and heatsinks,metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high compliance.
- ◇All our thermal pad series materials is very cost-effective materials which is made through advanced manufacturing process and with meeting the requirement of UL 94 V0 , RoHs and Reach compliance.
Typical Application
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- – Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
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- – ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
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- – Cooling or thermal Module, in all applications where a metal housing is used as heatsink.
Typical Properties of 1.0-7.5W/m.k Thermal Gap Pad | ||||||||||
Properties | Units | TCP100 | TCP150 | TCP200 | TCP300 | TCP500 | TCP600 | TCP800 | TCP110U | |
Color | — | Gray | Black | Dark Gray | Blue | Pink~Violet | Light Blue | Violet | pink/white | |
Reinforcement Carrier | — | — | — | — | — | — | — | — | Fiberglass | |
Thickness Range | mm | 0.25~15 | 0.25~15 | 0.25~15 | 0.25~15 | 0.25~15 | 0.3~10 | 1.0~10 | 0.5~10 | |
natural tacky | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 1 | |
Hardness | Shore C | 25,35 | 15,25,35 | 15,25,35 | 25,35 | 30 | 30 | 50 | 5, 15 | |
Density | g/cc | 1.8 | 2.2 | 2.4 | 2.6 | 3 | 3.6 | 3.8 | 2.0 | |
Continuous Use Temp | ℃ | -40 to 200 | ||||||||
ELECTRICAL | ||||||||||
Breakdown Voltage | Kv/mm | ≥9 | ≥9 | ≥9 | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | |
Volume Impedance | ohm-cm | ≥4×1012 | ≥5×1012 | ≥3.6×1013 | ≥1.1X1014 | ≥1.1X10 14 | ≥6.5X1010 | ≥6.5×1010 | ≥6.2X1015 | |
Dielectric Constant | 1MHz | 5.27 | 5.2 | 6 | 6.8 | 6.6 | 6.5 | 6.8 | 5.5 | |
Flame Rating | — | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
THERMAL | ||||||||||
Thermal Conductivity | W/m.k | 1.0 | 1.5 | 2.0 | 3.0 | 5.0 | 6.0 | 8.0 | 1.1 |
Contact SinoGuide for Thermal Gap Pads/Sheets, Thermal Pads, Thermal Interface Pads
Contact Us for further assistance with thermal pads, including thermal gap filler pads, thermally insulating foam, heat conductive pads, thermal conductive pads, and thermal interface pads.