Thermal Gap Filler Pads are high heat transfer media which conform to surface irregularities and adhere to a wide range of shapes and sizes of components; in particular, recessed areas and protrusions.
Where space between mating surfaces varies or is uneven, and where surface textures are normally a thermal transfer concern, the very pliable conformity of the pads is excellent for filling air gaps and minute variations.
A widely recognized axiom of chemical engineering and stress analysis states that, for every 10˚C change in temperature, the reaction is a factor of 2; i.e., mean-time-to-failure of a device can be reduced by a factor of 2 for every 10˚C temperature rise.
Four grades, each with a cost-effective formulation suitable for the thermal conductivity needed on a given application, accommodate most demanding situations. Convenient sheet configurations are suitable for die-cutting, or easy hand-slitting operations.
As shown in the drawings below, even the most highly polished mating surfaces do not make reliable contact surfaces. Complete physical contact is necessary to minimize the resistance to heat flow for the best thermally conductive path. All such surface voids, when properly filled with a conformable, thermally conductive gap filler pad, will in most cases exhibit close to the continuous characteristics of a solid metal of the same dimensions.
Factory Price Thermal Gap Filler/Thermally Conductive Pads, Gap Filler Pad
Silicone thermal gap filler with nature tack for CPU, GPU, VGA, CMOS chip. Thermal Gap Filler Pad is designed to be used in the applications that require the minimum amount of pressure on components and moderate thermal conductivity
Click Here to download a Technical Data Sheet
SinoGuide™ Enhanced Thermal Gap-filling Materials
Thermal Gap Filler Pads and Gap Filler Material for Any Thermal Solution
The Main Difference of SinoGuide Brand Thermal Gap Fillers
The thermal gap filler pad selection guide and comparison tables:
| TCP Series Type | Application Guidelines | Typical Thermal Conductivity | Test Method | |
| — | — | W/m.k | — | |
| TCP 110U Series | Fiberglass Reinforcement gap filler pad | 1.1 | ASTM-D5470 | |
| TCP100 Series | Low heat conductivity gap filler pad | 1.0 | ASTM-D5470 | |
| TCP150 Series | General Purpose gap filler pad, UL94 VO-V1 class | 1.5 | ASTM-D5470 | |
| TCP200 Series | General Purpose gap filler pad, UL94 VO class | 2.0 | ASTM-D5470 | |
| TCP300 Series | high heat conductivity gap filler pad | 3.0 | ASTM-D5470 | |
| TCP500 Series | Very high thrmal conductivity gap filler pad | 5.0 | ASTM-D5470 | |
| TCP800 Series | Extremely high performance thermal gap filler pad | 8.0 | ASTM-D5470 | |
| AL20 Series | Carbon fiber filled, Highest performance heat conductivity gap filler pad | 35 | ASTM-D5470 | |
| AL50 Series | Carbon fiber filled, Premium thermal conductivity gap filler pad | 50 | ASTM-D5470 | |
| TCP20 Series | High thermal resistance , low conductivity, high compressible closed-cell silicone foam | 0.2 | ASTM-D5470 | |
The tables will help you find the material that best suits your application needs. Also, if any help is necessary, simply contact us and we will be more then happy to assist you.
SinoGuide is a global leader in thermal interface materials technology. We are committed to providing our customers with outstanding service and the highest quality thermal products for your electronics cooling solutions…Read More
