The high performance thermal interface materials(TIMs) selection and application from Sinoguide Technology

Nowadays, large amount of Thermal interface materials (TIMs) have been used to transfer heat effectively from a heat-generating
device to a heat dissipation device or cold sink. With advances in packaging technology, the selection of asuitable TIM has become more complicated as each application will have different design requirements. The final selection should consider material properties beyond the thermal performance of the material. Compliance, thickness, processing, and response to reliability conditioning are key considerations when engineering at the final package.

The evolution of thermal interface materials (TIMs) has resulted from the need to meet more demanding thermal costs. Better heat management has enabled advanced processor and packaging technology and applications have diversified. A selector guide available from the Sinoguide Technology catalogue will steer the engineer accordingly knowing thermal performance, package design, TIM package location, and cost requirements. Despite the stringent competition of the thermal interface market, the Sinoguide Technology continually show unmatched higher performance and value-added materials. The performance is at much lower thermal resistance,higher thermal conductivity and ultra-softness to be applied to a heat dissipation device for speed of assembly, and low cost. Below picture shows a outlook for the application of TIM(thermal interface material) on power electronic device.

Below picture shows a tiny dongle mounted onto a printed circuit board (PCB). Dongle’s antenna connector is soldered onto the PCB’s SMA connector, presumably by hand, fingerprint visible on back of board. Thermal pad and heatsink stuck onto dongle, blue material is the thermal interface material applied for improving the thermal transfer.


Below picture is using 2mm thermal interface material in red to well fill up the air voids of delivering excellent thermal transfer.

Besides these above two sectors,the thermal pad also be applied on energy converter, computer memory chips, LED lighting and telecommunications etc.

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